Reflow soldering processes and troubleshooting : SMT, BGA, CSP and flip chip technologies /
By: Lee, Ning-Cheng
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Publisher: Oxford : Newnes, 2000Description: 384 p. : ill. ; 26 cm.Content type: text Media type: unmediated Carrier type: volumeISBN: 0750672188; 9780750672184:.Subject(s): Solder and soldering | Electronics packaging | Printed circuits -- Design and constructionDDC classification: 621.381531 Summary: Focused on technological innovations in the field of electronics packaging and production, this book explains the changes in reflow soldering processes and troubleshooting difficulties encountered during these processes in a variety of board types.
| Item type | Current library | Call number | Copy number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|
Standard Loan
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ATU Sligo Yeats Library Main Lending Collection | 621.381531 LEE (Browse shelf(Opens below)) | 1 | Available | 0049568 |
Bibliography.
Includes index.
Focused on technological innovations in the field of electronics packaging and production, this book explains the changes in reflow soldering processes and troubleshooting difficulties encountered during these processes in a variety of board types.