Design and assembly process implementation for BGAs /
By: IPC.
Series: ANSI.Publisher: Northbrook, Ill. : IPC, Association Connecting Electronics Industries, 2000Description: vi, 72 p. : ill. (some col.), forms ; 28 cm.Subject(s): Ball grid array technology -- Standards | Electronic packaging -- Standards | Microelectronic packaging -- Standards | Solder and soldering -- Standards | Multichip modules -- Standards| Item type | Current library | Call number | Copy number | Status | Date due | Barcode | Item holds |
|---|---|---|---|---|---|---|---|
Library Use Only
|
ATU Sligo Yeats Library Official Publications | STA (Browse shelf(Opens below)) | 1 | Not for loan | 0050918 |
Total holds: 0
Includes bibliographical references (p. 70-71)