Reflow soldering processes and troubleshooting : SMT, BGA, CSP and flip chip technologies /
By: Lee, Ning-Cheng
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Publisher: Oxford : Newnes, 2000Description: 384 p. : ill. ; 26 cm.Content type: text Media type: unmediated Carrier type: volumeISBN: 0750672188; 9780750672184:.Subject(s): Solder and soldering![](/opac-tmpl/bootstrap/images/filefind.png)
Item type | Current library | Call number | Copy number | Status | Date due | Barcode | Item holds |
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ATU Sligo Yeats Library Main Lending Collection | 621.381531 LEE (Browse shelf(Opens below)) | 1 | Available | 0049568 |
Bibliography.
Includes index.
Focused on technological innovations in the field of electronics packaging and production, this book explains the changes in reflow soldering processes and troubleshooting difficulties encountered during these processes in a variety of board types.